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Low Expansion Package for Deep Ultraviolet LED

In the manufacturing of deep ultraviolet LED packages, the yield during sealing improves. Enhancing the package's airtightness and heat dissipation can lead to increased device longevity.

Reduces the occurrence of cracks due to thermal expansion differences at the joints when using quartz glass as a cover glass. The yield during sealing is improved. The airtightness of the package is also enhanced due to material properties and metallization processing. The through-via structure improves heat dissipation, which is expected to extend the lifespan of the device. 【Features】 ■ The expansion coefficient of the package is about 1/4 that of aluminum nitride, resulting in good bonding compatibility with quartz glass and improved reliability. ■ The porosity is small, comparable to ceramics, and the airtightness of the package is enhanced by metallized sealing. ■ The reduction in the difference in expansion coefficients improves the yield during the production process (during sealing). 【Application Examples】 ■ Glass-ceramic package for sealing deep ultraviolet (UVC) LEDs ■ Glass-ceramic package for sealing deep ultraviolet (UVC) sensors